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HEATCOP CLAY is an amorphous product like clay, and it is easy to use for any type of object.
It contains Aerogel to minimize heat loss and can be cured by ambient heat or by heating after work.



| Type of product | Plate type |
|---|---|
| Hardening temperature |
|
Characteristics
Application
| Product | Applicable Temperature (℃) | Density (g/㎤) | Thermal Conductivity (W/m•K) | Thickness (㎜) | Flame retardant (UL94) | Hardening Condition |
|---|---|---|---|---|---|---|
| Insulation Clay Plate | -60~150 | 0.6 or less | 0.074 | 10 | V1 | Above 140℃, Within 4hrs |
| Before | After |
|---|---|
|
|
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| Type of Product | Amorphous type |
|---|---|
| Hardening temperature |
|
| Scope of use | Applying to work such as curved shapes that are difficult to apply clay-plate |